Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...

Abstract: 3D ferroelectric NAND (Fe-NAND) Quad-level cell (QLC) operation has been demonstrated for the first time to our knowledge, using the 3D CTN NAND test vehicle for mass production. The 3D ...

There was a regression that I believe happened in .NET 10 preview 7, though I am seeing more tests fail with this problem in rc1, so I am not totally sure, which we have a number of tests that save ...

Huawei just made a massive power play in the AI hardware wars. At Connect 2025 in Shanghai, rotating chairman Eric Xu unveiled the Atlas 950 and Atlas 960 SuperPoDs – absolutely enormous clusters of ...