Automation isn't just for builds and deployments anymore—let’s build something fun with it. In this project, we'll explore how to turn GitHub Issues into a creative workflow using Issue Ops. We'll ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

Lam Research has unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high ...

Abstract: This paper introduces a drone-based 3D array distributed beamforming technique to enhance SIGINT capabilities. By employing the S-Metric Selection Evolutionary MultiObjective Algorithm ...

Abstract: In this work, the design, fabrication, and experimental verification of a plastic 3D printed metal-coated double-ridged waveguide antenna array is presented. The antenna array consists of ...

Boeing, with its recent unveiling of a 3D-printed solar array substrate, is set to enhance production efficiency and reduce costs, which aligns well with recent market trends. Over the past quarter, ...

Mînzu, V. and Arama, I. (2025) A New Method to Predict the Mechanical Behavior for a Family of Composite Materials. Journal ...

EL SEGUNDO, Calif., Sept. 10, 2025 /PRNewswire/ -- Boeing (BA) [NYSE: BA] unveiled a 3D‑printed solar array substrate approach that compresses composite build times by up to six months on a typical ...